Patent Assignment
Reel/Frame 059131/0394
Assignment of Assignor's Interest
Recorded: 2022-03-01
Pages: 6
Assignors
HWANG, SUNG-MIN
Executed: 2022-01-22
SHIM, JAE-JOO
Executed: 2022-01-22
LEE, DONG-SIK
Executed: 2022-01-22
PARK, BONGTAE
Executed: 2022-01-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional (3D) Semiconductor Memory Device Including a Separation Structure and Electronic System Including the Same