Patent Assignment
Reel/Frame 059139/0264
Assignment of Assignor's Interest
Recorded: 2022-03-01
Pages: 3
Assignor
ZHOU, WEI
Executed: 2022-02-16
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Solder Based Hybrid Bonding for Fine Pitch and Thin Blt Interconnection