Patent Assignment
Reel/Frame 059140/0765
Assignment of Assignor's Interest
Recorded: 2022-02-16
Pages: 4
Assignor
JANG, CHULYONG
Executed: 2021-11-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Manufacturing Semiconductor Package