Patent Assignment
Reel/Frame 059151/0930
Assignment of Assignor's Interest
Recorded: 2022-03-02
Pages: 3
Assignors
GAO, GUILIAN
Executed: 2020-06-03
MIRKARIMI, LAURA WILLS
Executed: 2020-06-08
FOUNTAIN, JR., GAIUS GILLMAN
Executed: 2020-06-08
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Mitigating Surface Damage of Probe Pads in Preparation for Direct Bonding of a Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →