IP Library › Assignment 059159/0957
Patent Assignment
Reel/Frame 059159/0957

Assignment of Assignor's Interest

Recorded: 2022-03-03 Pages: 10
Assignors
SURAJ PRAKASH, FNU
Executed: 2022-01-24
THADESAR, PARAGKUMAR AJAYBHAI
Executed: 2022-01-25
LEE, JOHN JONG-HOON
Executed: 2022-02-06
RAMAN, NIKHIL
Executed: 2022-02-11
SONG, PENG
Executed: 2022-02-07
CARRARA, FRANCESCO
Executed: 2022-01-24
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property (1)
Package Comprising Substrate with Coupling Element for Integrated Devices
Application: 17/575,492 →
Publication: US 2023/0223362