Patent Assignment
Reel/Frame 059170/0467
Assignment of Assignor's Interest
Recorded: 2022-03-04
Pages: 7
Assignors
KIM, YUMIN
Executed: 2022-03-02
KIM, DOYOON
Executed: 2022-03-02
KIM, SEYUN
Executed: 2022-03-02
SONG, HYUNJAE
Executed: 2022-03-02
YANG, SEUNGYEUL
Executed: 2022-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Device Including Vertical Stack Structure, Method of Fabricating the Same, and Electronic Device Including Memory Device