Patent Assignment
Reel/Frame 059172/0503
Assignment of Assignor's Interest
Recorded: 2022-03-04
Pages: 4
Assignors
CHEN, CHIH-HAO
Executed: 2022-03-02
CHENG, PO-YUAN
Executed: 2022-03-02
WANG, PU
Executed: 2022-03-02
CHENG, LI-HUI
Executed: 2022-03-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Heat Dissipation Structures for Integrated Circuit Packages and Methods of Forming the Same