Patent Assignment
Reel/Frame 059172/0550
Assignment of Assignor's Interest
Recorded: 2022-03-04
Pages: 4
Assignors
DELACRUZ, JAVIER A.
Executed: 2017-10-27
TEIG, STEVEN L.
Executed: 2017-10-27
HUANG, SHAOWU
Executed: 2017-10-27
PLANTS, WILLIAM C.
Executed: 2017-10-27
FISCH, DAVID EDWARD
Executed: 2017-10-26
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Direct-Bonded Native Interconnects And Active Base Die
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 4, 2022
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: XCELSIS CORPORATION
Reel/Frame 059321/0416 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →