Patent Assignment
Reel/Frame 059187/0342
Assignment of Assignor's Interest
Recorded: 2022-03-07
Pages: 3
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2019-04-12
SITARAM, ARKALGUD R.
Executed: 2019-04-12
ENQUIST, PAUL
Executed: 2019-04-18
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Stacked Dies and Methods for Forming Bonded Structures
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 6, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 063280/0985 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →