Patent Assignment
Reel/Frame 059197/0812
Assignment of Assignor's Interest
Recorded: 2022-03-08
Pages: 3
Assignors
LEE, MI SEON
Executed: 2022-02-23
KIM, SUNG KYU
Executed: 2022-02-23
KIM, JONG HOON
Executed: 2022-02-23
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Substrates Bonded to Each Other and Methods for Fabricating the Same