IP Library Assignment 059214/0375
Patent Assignment
Reel/Frame 059214/0375

Assignment of Assignor's Interest

Recorded: 2022-03-09 Pages: 14
Assignors
CHEN, JIUN-RUEY
Executed: 2021-12-15
JEZEWSKI, CHRISTOPHER
Executed: 2022-03-09
PLOMBON, JOHN
Executed: 2021-12-09
RESHOTKO, MIRIAM
Executed: 2021-12-09
KOBRINSKY, MAURO
Executed: 2021-12-13
CLENDENNING, SCOTT B.
Executed: 2021-12-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Fill of Vias in Single and Dual Damascene Structures Using Self-Assembled Monolayer
Application: 17/558,423 →
Publication: US 2023/0197601