Patent Assignment
Reel/Frame 059217/0132
Assignment of Assignor's Interest
Recorded: 2022-02-17
Pages: 7
Assignors
PARK, SANGJINE
Executed: 2022-01-18
JEONG, JIHOON
Executed: 2022-01-18
KIM, YOUNGHOO
Executed: 2022-01-18
LEE, KUNTACK
Executed: 2022-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus for Drying Wafer and Method for Drying Wafer