IP Library › Assignment 059227/0079
Patent Assignment
Reel/Frame 059227/0079

Assignment of Assignor's Interest

Recorded: 2022-03-10 Pages: 8
Assignors
SATO, TOMOAKI
Executed: 2022-01-31
KIKKAWA, YUKI
Executed: 2022-01-31
SHIMODA, TAKAFUMI
Executed: 2022-02-14
NEGISHI, TAKAYUKI
Executed: 2022-02-03
Assignee
TOKUYAMA CORPORATION
1-1, MIKAGE-CHO, SHUNAN-SHI, YAMAGUCHI, 745-8648, JAPAN
Covered Property (1)
Semiconductor Wafer Treatment Liquid and Production Method Thereof
Application: 17/642,059 →
Publication: US 2022/0411937