IP Library Assignment 059233/0652
Patent Assignment
Reel/Frame 059233/0652

Assignment of Assignor's Interest

Recorded: 2022-03-11 Pages: 13
Assignors
XIN, SHUNING
Executed: 2022-03-01
LIN, ZHEN-DUAN
Executed: 2022-03-01
LIAO, YANQIU
Executed: 2022-03-01
SHI, JUNPENG
Executed: 2022-03-01
CAO, AIHUA
Executed: 2022-03-01
YU, CHANGCHIN
Executed: 2022-03-01
HSU, CHEN-KE
Executed: 2022-03-01
LIAO, CHI-WEI
Executed: 2022-03-01
LEE, CHIA-EN
Executed: 2022-03-01
WU, ZHENG
Executed: 2022-03-01
Assignee
QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
YUANQIAN VILLAGE, SHIJING TOWN, NANAN CITY, QUANZHOU, FUJIAN, CHINA
Covered Property (1)
Light-Emitting Diode Packaging Module Having Encapsulated Array of Led Chips
Application: 17/691,638 →
Publication: US 2022/0199592
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 20, 2026
From: QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY CO., LTD.
To: HUBEI SANAN OPTOELECTRONICS CO.,LTD.
Reel/Frame 075700/0052 →