Patent Assignment
Reel/Frame 059252/0111
Assignment of Assignor's Interest
Recorded: 2022-03-14
Pages: 4
Assignors
CHANG, WEI TENG
Executed: 2022-02-24
KUO, MENG-TSUNG
Executed: 2022-03-13
HUANG, CHIH-KUNG
Executed: 2022-03-02
YU, HUI-CHANG
Executed: 2022-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Dam Structure on Lid to Constrain a Thermal Interface Material in a Semiconductor Device Package Structure and Methods for Forming the Same