Patent Assignment
Reel/Frame 059254/0220
Assignment of Assignor's Interest
Recorded: 2022-03-14
Pages: 5
Assignors
LEE, CHENG-CHIN
Executed: 2022-03-10
SHUE, SHAU-LIN
Executed: 2022-03-10
LEE, SHAO-KUAN
Executed: 2022-03-10
CHANG, HSIAO-KANG
Executed: 2022-03-10
TSAI, CHERNG-SHIAW
Executed: 2022-03-10
CHENG, KAI-FANG
Executed: 2022-03-10
HUANG, HSIN-YEN
Executed: 2022-03-10
LIN, MING-HSIEN
Executed: 2022-03-10
CHOU, CHUAN-PU
Executed: 2022-03-13
CHEN, HSIN-PING
Executed: 2022-03-10
WU, CHIA-TIEN
Executed: 2022-03-10
YANG, KUANG-WEI
Executed: 2022-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure with Improved Heat Dissipation