Patent Assignment
Reel/Frame 059270/0087
Assignment of Assignor's Interest
Recorded: 2022-03-15
Pages: 7
Assignors
KLEIN, AVI
Executed: 2022-03-14
BARASH, DROR
Executed: 2022-03-14
HOROWITZ, GUY
Executed: 2022-03-14
REINHERZ, OREN
Executed: 2022-03-14
HERMAN, ROI
Executed: 2022-03-14
EISENBERG, AMIT
Executed: 2022-03-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
High Speed Interface for Multi Image Sensor Device