Patent Assignment
Reel/Frame 059272/0558
Assignment of Assignor's Interest
Recorded: 2022-03-15
Pages: 5
Assignor
KANG, JUNGHOON
Executed: 2021-11-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Package, and Semiconductor Package