Patent Assignment
Reel/Frame 059274/0707
Assignment of Assignor's Interest
Recorded: 2022-03-15
Pages: 3
Assignors
TAI, WEN-CHUAN
Executed: 2022-03-10
HU, FAN
Executed: 2022-03-11
CHEN, HSIANG-FU
Executed: 2022-03-10
PENG, LI-CHUN
Executed: 2022-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 96950, TAIWAN
Covered Property
(1)
Bonding Structure and Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Sep 23, 2024
From: SHERLOCK BIOSCIENCES, INC
To: NOVALIS LIFESCIENCE INVESTMENTS II, L.P.
Reel/Frame 068659/0118 →
Corrective Assignment to Correct the Correct the Assignee Name Previously Recorded at Reel: 68659 Frame: 118. Assignor(S) Hereby Confirms the Security Interest.
Sep 24, 2024
From: SHERLOCK BIOSCIENCES, INC
To: NOVALIS LIFESCIENCES INVESTMENTS II, L.P.
Reel/Frame 069031/0946 →