Patent Assignment
Reel/Frame 059281/0728
Assignment of Assignor's Interest
Recorded: 2022-03-16
Pages: 3
Assignors
SHAN, BOHAN
Executed: 2022-03-10
WU, JIAQI
Executed: 2022-03-10
LU, XIAO
Executed: 2022-03-14
OUVAROV-BANCALERO, VALERY
Executed: 2022-03-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Bumps Comprising Tin, Cooper and Bismuth for Liquid Metal Socket Interconnects
Application:
17/696,162 →
Publication:
US 2023/0299024