IP Library › Assignment 059281/0728
Patent Assignment
Reel/Frame 059281/0728

Assignment of Assignor's Interest

Recorded: 2022-03-16 Pages: 3
Assignors
SHAN, BOHAN
Executed: 2022-03-10
WU, JIAQI
Executed: 2022-03-10
LU, XIAO
Executed: 2022-03-14
OUVAROV-BANCALERO, VALERY
Executed: 2022-03-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Bumps Comprising Tin, Cooper and Bismuth for Liquid Metal Socket Interconnects
Application: 17/696,162 →
Publication: US 2023/0299024