IP Library › Assignment 059305/0971
Patent Assignment
Reel/Frame 059305/0971

Assignment of Assignor's Interest

Recorded: 2022-03-18 Pages: 7
Assignors
WAIDHAS, BERND
Executed: 2022-03-11
KOLLER, SONJA
Executed: 2022-03-10
PROSCHWITZ, JAN
Executed: 2022-03-15
DE MESA, EDUARDO
Executed: 2022-03-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Packaging Architecture with Thermally Conductive Integrated Circuit Bridge
Application: 17/698,282 →
Publication: US 2023/0299043