Patent Assignment
Reel/Frame 059305/0971
Assignment of Assignor's Interest
Recorded: 2022-03-18
Pages: 7
Assignors
WAIDHAS, BERND
Executed: 2022-03-11
KOLLER, SONJA
Executed: 2022-03-10
PROSCHWITZ, JAN
Executed: 2022-03-15
DE MESA, EDUARDO
Executed: 2022-03-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Packaging Architecture with Thermally Conductive Integrated Circuit Bridge
Application:
17/698,282 →
Publication:
US 2023/0299043