IP Library Assignment 059309/0964
Patent Assignment
Reel/Frame 059309/0964

Assignment of Assignor's Interest

Recorded: 2022-03-18 Pages: 19
Assignors
WANG, HUIZHAO
Executed: 2020-03-04
RAMASUBRAMANIAN, KARTHIK
Executed: 2020-03-04
BYKOV, DENIS
Executed: 2020-03-04
WOOD, JAMES
Executed: 2020-03-04
JIN, JUN
Executed: 2020-05-03
FANG, LIN
Executed: 2020-03-04
LIU, HONGPING
Executed: 2020-03-04
MUNG, BENJAMIN
Executed: 2020-05-11
LU, PING
Executed: 2020-05-15
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Wireless Data Transmission
Application: 17/698,492 →
Publication: US 2022/0210249
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059847/0433 →
Release of Security Interest May 2, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 063516/0756 →
Assignment of Assignor's Interest May 8, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: MAXLINEAR, INC.
Reel/Frame 063572/0701 →
Release of Security Interest in Patents Recorded at Reel 059847, Frame 0433 Nov 9, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065525/0001 →