Patent Assignment
Reel/Frame 059321/0186
Assignment of Assignor's Interest
Recorded: 2022-03-21
Pages: 6
Assignors
PARK, HYOJIN
Executed: 2022-03-02
KANG, SONGYUN
Executed: 2022-03-02
PARK, SUNG YONG
Executed: 2022-03-02
KIM, KEON-WOO
Executed: 2022-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Polishing Apparatus, Substrate Polishing Method Using the Same, and Semiconductor Fabrication Method Including the Same