Patent Assignment
Reel/Frame 059327/0601
Assignment of Assignor's Interest
Recorded: 2022-03-21
Pages: 4
Assignor
JUNG, HWAN-WOOK
Executed: 2022-02-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Offset Semiconductor Package