Patent Assignment
Reel/Frame 059341/0101
Assignment of Assignor's Interest
Recorded: 2022-03-22
Pages: 3
Assignors
CHIU, SHIH-HANG
Executed: 2022-03-16
WANG, WEI-CHENG
Executed: 2022-03-16
WU, CHUNG-CHIANG
Executed: 2022-03-20
CHUI, CHI ON
Executed: 2022-03-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Metal Gate Fin Electrode Structure by Etching Back Metal Fill