Patent Assignment
Reel/Frame 059347/0285
Assignment of Assignor's Interest
Recorded: 2022-03-08
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having Stacked Semiconductor Chips Interconnected with Support Structures via Tsv