Patent Assignment
Reel/Frame 059350/0467
Assignment of Assignor's Interest
Recorded: 2022-03-23
Pages: 3
Assignors
CHEN, HSIEN-WEI
Executed: 2022-03-22
JUANG, JING-YE
Executed: 2022-03-23
JENG, SHIN-PUU
Executed: 2022-03-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Reconstructed Substrates for High I/O Counts Application and Methods for Forming the Same