Patent Assignment
Reel/Frame 059370/0871
Assignment of Assignor's Interest
Recorded: 2022-03-23
Pages: 6
Assignors
KIM, JUHYEON
Executed: 2022-01-17
KIM, HYOEUN
Executed: 2022-01-17
SEO, SUNKYOUNG
Executed: 2022-01-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same