Patent Assignment
Reel/Frame 059377/0075
Assignment of Assignor's Interest
Recorded: 2022-03-23
Pages: 3
Assignee
AP MEMORY TECHNOLOGY CORPORATION
10F.-1, NO.1, TAIYUAN 1ST ST., ZHUBEI CITY, HSINCHU COUNTY, 30288, TAIWAN
Covered Property
(1)
Semiconductor Structure and Methods for Bonding Tested Wafers and Testing Pre-Bonded Wafers