Patent Assignment
Reel/Frame 059380/0462
Assignment of Assignor's Interest
Recorded: 2022-03-23
Pages: 6
Assignors
KANG, MYUNGSAM
Executed: 2022-02-24
KIM, JEONGSEOK
Executed: 2022-02-24
CHO, BONGJU
Executed: 2022-02-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Heat Dissipation Structure