Patent Assignment
Reel/Frame 059383/0434
Assignment of Assignor's Interest
Recorded: 2022-03-23
Pages: 3
Assignor
CHANG, JEN-YUAN
Executed: 2022-03-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package with High Density of Through-Silicon Vias (Tsv)