Patent Assignment
Reel/Frame 059396/0534
Assignment of Assignor's Interest
Recorded: 2022-03-24
Pages: 4
Assignors
CHENG, PO-JEN
Executed: 2022-02-14
WANG, WEI-JEN
Executed: 2022-03-16
CHEN, FU-YUAN
Executed: 2022-02-14
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Electronic Structure Having a Protrusion Structure Disposed in a Gap Between a Circuit Pattern Structure and a Packaging Structure