Patent Assignment
Reel/Frame 059410/0575
Assignment of Assignor's Interest
Recorded: 2022-03-28
Pages: 3
Assignors
LANDRU, DIDIER
Executed: 2021-09-10
KONONCHUK, OLEG
Executed: 2021-09-29
BEN MOHAMED, NADIA
Executed: 2021-09-27
Assignee
SOITEC
CHEMIN DES FRANQUES, PARC TECHNOLOGIQUE DES FONTAINES, BERNIN, 38190, FRANCE
Covered Property
(1)
System for Fracturing a Plurality of Wafer Assemblies