Patent Assignment
Reel/Frame 059418/0586
Assignment of Assignor's Interest
Recorded: 2022-03-28
Pages: 6
Assignors
KWON, DAEHYUN
Executed: 2021-10-01
KIM, DONGHEE
Executed: 2021-10-01
HUH, SUNGOH
Executed: 2021-10-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device, Semiconductor Substrate, and Test System Including the Integrated Circuit Device