Patent Assignment
Reel/Frame 059419/0550
Assignment of Assignor's Interest
Recorded: 2022-03-29
Pages: 5
Assignors
WANG, PO-HAN
Executed: 2022-03-02
LIAO, SIH-HAO
Executed: 2022-03-09
CHEN, WEI-CHIH
Executed: 2022-03-05
CHO, HUNG-CHUN
Executed: 2022-03-06
TSENG, TING-CHEN
Executed: 2022-03-02
HU, YU-HSIANG
Executed: 2022-03-02
KUO, HUNG-JUI
Executed: 2022-03-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Including Auxiliary Dielectric Portion