Patent Assignment
Reel/Frame 059427/0760
Assignment of Assignor's Interest
Recorded: 2022-03-29
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Module Substrate for Semiconductor Module and Semoconductor Memory Module