Patent Assignment
Reel/Frame 059436/0329
Assignment of Assignor's Interest
Recorded: 2022-03-30
Pages: 3
Assignors
KANG, BUM SUK
Executed: 2022-02-08
LEE, SU JIN
Executed: 2022-02-08
YOON, DAE WOO
Executed: 2022-02-08
KIM, DA MI
Executed: 2022-02-08
KIM, JEONG RYEOL
Executed: 2022-02-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Ceramic Electronic Component Including Bonding Layer Between Body and Sintered External Electrode