Patent Assignment
Reel/Frame 059441/0484
Assignment of Assignor's Interest
Recorded: 2022-03-30
Pages: 4
Assignors
JUNG, BAECK GI
Executed: 2022-02-18
YUN, CHUL JUNG
Executed: 2022-02-18
AHN, JAE PIL
Executed: 2022-02-18
KWON, YOUNG HWAN
Executed: 2022-02-18
Assignee
SAMSUNG SDI CO., LTD.
150-20, GONGSE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 17084, KOREA, REPUBLIC OF
Covered Property
(1)
Hybrid Circuit Board and Battery Pack Having Same
Application:
17/654,745 →
Publication:
US 2022/0304158