Patent Assignment
Reel/Frame 059446/0307
Assignment of Assignor's Interest
Recorded: 2022-03-30
Pages: 4
Assignors
YOU, JIA-CHUAN
Executed: 2020-10-14
JU, SHI-NING
Executed: 2020-10-14
CHIANG, KUO-CHENG
Executed: 2020-10-14
WANG, CHIH-HAO
Executed: 2020-10-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6,, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same