Patent Assignment
Reel/Frame 059456/0123
Assignment of Assignor's Interest
Recorded: 2022-03-31
Pages: 4
Assignors
HSU, WEI-CHIEH
Executed: 2022-03-30
HUANG, HAN-HSIANG
Executed: 2022-03-30
LIN, YU-SHENG
Executed: 2022-03-30
CHEN, CHIEN-SHENG
Executed: 2022-03-30
JENG, SHIN-PUU
Executed: 2022-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Fine Pitch Chip Interconnect Structure for Bump Bridge and High Temperature Storage Improvement and Methods for Forming the Same
Application:
17/709,627 →
Publication:
US 2023/0317577