Patent Assignment
Reel/Frame 059458/0416
Assignment of Assignor's Interest
Recorded: 2022-03-31
Pages: 4
Assignors
PARK, CHEONIL
Executed: 2022-01-06
KIM, WONKEUN
Executed: 2022-01-06
EUM, MYOUNGCHUL
Executed: 2022-01-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Semiconductor Device and Method of Separating Substrate