Assignment of Assignor's Interest

Recorded: 2022-03-31 Pages: 6

Assignor

JEONG, JAEWOO

Executed: 2022-01-18

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG‐RO, YEONGTONG‐GU, SUWON‐SI, GYEONGGI‐DO, 443‐742, KOREA, REPUBLIC OF

Covered Property (1)

Tetragonal Half Metallic Heusler Compounds

Application: 17/710,438 →

Publication: US 2023/0320231

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.