IP Library › Assignment 059466/0233
Patent Assignment
Reel/Frame 059466/0233

Assignment of Assignor's Interest

Recorded: 2022-03-31 Pages: 5
Assignor
JEONG, JAEWOO
Executed: 2022-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG‐RO, YEONGTONG‐GU, SUWON‐SI, GYEONGGI‐DO, 443‐742, KOREA, REPUBLIC OF
Covered Property (1)
Tetragonal Half Metallic Half-Heusler Compounds
Application: 17/710,399 →
Publication: US 2023/0317129
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 31, 2022
From: FALEEV, SERGEY; FILIPPOU, PANAGIOTIS CHARILAOS; FERRANTE, YARI; GARG, CHIRAG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 059466/0203 →