Patent Assignment
Reel/Frame 059467/0652
Assignment of Assignor's Interest
Recorded: 2022-04-01
Pages: 6
Assignors
LEE, JEONG HYUN
Executed: 2021-11-11
PARK, HWAN PIL
Executed: 2021-11-11
SHIM, JONG BO
Executed: 2021-11-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating Same