Patent Assignment
Reel/Frame 059467/0710
Assignment of Assignor's Interest
Recorded: 2022-04-01
Pages: 4
Assignor
ISHIKAWA, SHINYA
Executed: 2022-02-18
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Support and Substrate Processing Apparatus