Patent Assignment
Reel/Frame 059467/0730
Assignment of Assignor's Interest
Recorded: 2022-04-01
Pages: 3
Assignors
LEE, TSUNG-LIN
Executed: 2022-03-16
YEAP, CHOH-FEI
Executed: 2022-03-16
LIN, DA-WEN
Executed: 2022-03-28
YEH, CHIH-CHIEH
Executed: 2022-03-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method for Forming the Same