Patent Assignment
Reel/Frame 059471/0682
Assignment of Assignor's Interest
Recorded: 2022-04-01
Pages: 4
Assignor
MA, KEUM HEE
Executed: 2021-12-10
Assignee
LTD., SAMSUNG ELECTRONICS C
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip with Signal Bump and Dummy Bump, Semiconductor Package Including the Semiconductor Chip and Method for Manufacturing the Semiconductor Package