Patent Assignment
Reel/Frame 059474/0506
Assignment of Assignor's Interest
Recorded: 2022-04-01
Pages: 15
Assignors
MEYYAPPAN, KARUMBU
Executed: 2022-01-05
SMALLEY, JEFFORY L.
Executed: 2022-01-05
MURTAGIAN, GREGORIO
Executed: 2022-03-30
NEKKANTY, SRIKANT
Executed: 2022-01-14
MORET, ERIC J.M.
Executed: 2022-01-06
TADAYON, POOYA
Executed: 2022-01-05
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Liquid Metal Interconnect for Modular System on an Interconnect Server Architecture