Patent Assignment
Reel/Frame 059484/0883
Assignment of Assignor's Interest
Recorded: 2022-03-23
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing Printed Wiring Board