Patent Assignment
Reel/Frame 059499/0113
Assignment of Assignor's Interest
Recorded: 2022-04-05
Pages: 6
Assignors
KIM, YONGHA
Executed: 2021-11-17
KANG, BONGGYU
Executed: 2021-11-17
JANG, YOUNGSOO
Executed: 2021-11-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Thermal Interface Material Layer and Semiconductor Package